Kontakt Chemie Heat Dissipating Thermal Paste (20g)

Description

The Kontakt Chemie thermal paste (reference 32044) is an industrial-grade heat dissipating compound, with a white silicone formulation, essential for the maintenance, assembly, and repair of electronic equipment. Specifically developed to fill the micro-asperities and air pockets that are inevitable between the contact surfaces of semiconductor components and their metal heatsinks, this thermal grease drastically improves the overall thermal transfer coefficient. It is the reference product for computer repair workshops, power module repairers (TV, audio, automotive), and industrial electronics technicians.

In terms of physico-chemical properties, the Kontakt Chemie formula combines a stable silicone fluid with a high concentration of heat-conducting metal oxides. This synergy allows it to maintain perfect viscosity and a homogeneous texture over a very wide thermal range extending from -40 °C to +200 °C, ensuring that the product will neither dry out, harden, nor migrate (run) out of the application area under the effect of repeated heating cycles. Furthermore, its high dielectric strength makes it an exceptional electrical insulator, eliminating any risk of short-circuit or unintentional capacitive bridging, even in the event of accidental overflow onto printed circuit boards or adjacent SMD component pins.

The 20-gram tube packaging offers an excellent economic compromise for regular workbench use, allowing for precise application and limiting waste compared to large industrial pots, while protecting the compound from ambient air oxidation.

Technical Specifications

• Capacity: 20 g tube
• Chemical base: Silicone oil loaded with conductive metal oxides
• Functional temperature range: Set from -40 °C to +200 °C
• Colour: White
• Electrical properties: Dielectric insulator (no risk of short-circuit)
• Applications: Mounting of power transistors, diodes, processors, LED modules, and diode bridges on heatsinks

Workshop Advice & Usage

To obtain an optimal reduction in junction temperature and avoid overheating, the application of thermal paste must follow strict rules. Before any application, meticulously clean both contact surfaces (component and heatsink) using isopropyl alcohol to remove old baked-on residues or storage greases. Then apply a micro-touch of product and spread it to obtain an extremely thin and uniform film, almost translucent. The final thickness after mechanical tightening must be micrometric. Keep in mind that thermal paste conducts heat less well than the pure metal of the heatsink: an excess thickness will trap heat instead of dissipating it, causing a thermal insulation effect opposite to the desired effect.