MaAnt F008B Ultra-Fast Drying Transparent UV Glue (20g)

Description

The MaAnt F008B transparent UV glue (Transparent Soft technology) is a precision fluid dielectric insulator, specifically formulated for micro-soldering and electronic refurbishment laboratories. This technical varnish allows for the instant securing of flying wires, the restructuring of the solder mask on damaged printed circuit boards on smartphone motherboards, and the insulation of sensitive contact points. Its transparent and flexible formulation offers the crucial advantage of maintaining excellent structural flexibility, preventing vibrations or mechanical micro-tensions from breaking repaired copper lines.

Equipped with a high-reactivity photo-initiator agent, the MaAnt F008B resin polymerises in just 3 seconds under the action of a targeted ultraviolet light beam. Once solidified, it forms an airtight and hydrophobic barrier that protects micro-components against short circuits, oxidation, and moisture infiltration. Its advanced thermal stability allows it to withstand the heating cycles of soldering irons and hot air stations during subsequent interventions on peripheral chips, thus ensuring that it does not flake or liquefy after application.

The packaging is optimised for surgical application. The fluid viscosity of the product is perfectly dosed to infiltrate under components and coat micrometric tracks using a dispensing needle, without smearing onto adjacent contact areas.

Technical Specifications

• Manufacturer reference: MaAnt F008B (Transparent Soft)
• Capacity: 20 g
• Resin type: Photo-curable insulation fluid (UV Curing)
• Physical properties: Transparent and flexible after curing
• Polymerisation time: ~3 seconds (under 365 nm UV spectrum)
• Applications: Fixing jumper lines, PCB track insulation, BGA/FPC dielectric protection

Workshop Advice & Usage

To achieve perfect through-curing and prevent the glue from remaining viscous or liquid under its surface, apply the resin in extremely thin layers. If your repair requires filling a cavity or creating a thick reinforcement, proceed in stages by curing each micro-deposit for 3 to 5 seconds before applying the next layer. The use of a workshop UV lamp emitting a wavelength of 365 nm is imperative to correctly activate the chemical drying process in 3 seconds; standard low-power UV lamps or nail lamps will significantly slow down the process. In case of overflow onto active solder pads, immediately clean the area with isopropyl alcohol before exposing it to UV light.